0102030405
Organic Intermediate 2-Ethylimidazole CAS 1072-62-4 me ke kumu kūʻai maikaʻi loa.
Waiwai
•ʻO ke kaomi mahu:0.013mmHg ma 25°C
•Lae hehee:78-81 °C(māmā)
•Lae paila:268 °C ma 760 mmHg
•Lae Flash:133.1 °C
•Hōʻike Hōʻike:1.515
• Waihona Manawa:Hoʻopaʻa ʻia i loko o kahi maloʻo, lumi wela
•ʻO ka mānoanoa :1.024 g/cm3
•Hiki i ka wai.:Hiki ke hoʻoheheʻe ʻia i ka wai (617 g/L ma 20°C)
•PSA:28.68000
•PKA:14.38±0.10(Wanamua)
• Ke 'ano: Ke'oke'o a he melemele iki
• LogP:0.97210
•Misa pololei:96.068748264
Hōʻike
Nā mea | Nā kikoʻī | |
| Ka nana aku | Keʻokeʻo a i ʻole ka pauka keʻokeʻo a i ʻole ka mana crystlline, ʻaʻohe ʻala | |
| Ka hoʻoheheʻe | Hiki ke hoʻoheheʻe ʻia i ka N,N-Dimethylformamide, Hiki ke hoʻoheheʻe ʻia i loko o ka methanol, Hiki ke hoʻoheheʻe ʻia i loko o ka wai. | |
| Lae hehee | 152°C~156°C | |
| ʻIke (%) | 99% | |
Hoohana Huahana
1) Nā lako uila a me nā mīkini
Hoʻohana nui ʻia ʻo 2-Ethylimidazole no ka hoʻopaʻa ʻana, encapsulation, ka uhi ʻana a me ka laminating o nā mea kani, nā mika, nā ʻāpana uila like ʻole, nā mīkini kemika, nā kaʻa a me ka ʻoihana pale.
2) Resin
Hiki ke hoʻohana ʻia ka 2-Ethylimidazole no ka epoxy resin medium temperature curing agent.
Pūʻolo a me ka waiho ʻana
Pūʻolo:
25kg / pahu pahu a i ʻole e like me kāu mau koi.
Manaʻo: Hiki ke hoʻopaʻa ʻia ka haku melemele a me ka nui e nā koi o nā mea kūʻai aku
Waihona:
ʻO ka lewa inert, ka wela lumi. E mālama i ka pahu i paʻa paʻa i kahi maloʻo, anuanu a maikaʻi hoʻi. E kūʻai ma kahi kaʻawale mai nā pahu meaʻai a i ʻole nā mea like ʻole.
Palekana Palekana
Hoʻomalu no ka mālama pono ʻana
ʻO ka lawelawe ʻana ma kahi wahi maikaʻi. E ʻaʻahu i nā lole pale kūpono. Hōʻalo i ka pili ʻana me ka ʻili a me nā maka. E pale i ka hana ʻana o ka lepo a me nā aerosol. E hoʻohana i nā mea hana ʻole. Kāohi i ke ahi i hana ʻia e ka mahu hoʻolele electrostatic.